Surfaces can harbour infectious pathogens responsible for food poisoning. Antimicrobial Copper kills 99.9% of E.coli O157:H7 within 2 hours of exposure and can help to create a hygienic environment.


In the right conditions, one bacterium could become several million in eight hours and thousands to millions in twelve hours. Antimicrobial Copper has a potent efficacy against the organisms which cause food poisoning.

Campylobacter causes the greatest number of cases of foodborne illness in temperate countries each year. There were about 55,000 reported cases of campylobacteriosis in the UK in 2008 but the UK Food Standards Agency (FSA) are aware that many more cases go unreported - the realistic number of cases is more likely to be closer to 375,000 each year.  (FSA website accessed July 2010.)

Other headlining pathogens, such as the verocytotoxin-producing E. coli O157 and Listeria monocytogenes, cause fewer infections but the degree of hospitalisation is relatively higher and the chance of death in the case of Listeriosis is typically 30%. Common to all food hygiene is the need to reduce cross-contamination and copper coatings can be deployed in suitable areas to assist with reducing microbial bioburden.  Dry food preparation counters, door handles and sink hardware can easily be upgraded to use Antimicrobial Copper.

Anti-microbial Nanocopper

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Efficient catalysts: The large and highly active surface area, nano copper has a greatly enhancement catalytic efficiency. Instead of conventional micro copper can be used for the methanol industry.

Conductive paste: Electronic paste is widely used in microelectronics industry packaging, connectivity, miniaturization of microelectronic devices. Nano copper electronic paste has superior performance as micro copper. It is widely used in MLCC.

Sintering additives: Nano-powder has a large volume ratio of surface atoms, which demonstrate a high energy state. In the powder metallurgical industry, it can be used as a sintering additive to reduce sintering temperatures in ceramic and diamond tools production.

Medicine and anti bacteria: Nano copper can be used widely in medical industry as an anti-bacterial and more.

Lubricant addictive: Nano copper powder can be dispersed into lubricants to decrease the surface friction and repair micro defects of the friction surface.

Copper (Cu) Nanoparticles Applications:

Copper is a ductile metal with very high thermal and electrical conductivity. Pure copper is soft and malleable; an exposed surface has a reddish-orange tarnish. It is used as a conductor of heat and electricity, a building material, and a constituent of various metal alloys. Primary  uses: Capacitor materials; Catalysts; Conductive coatings; Conductive inks; Conductive pastes; High thermal conductivity materials; Lubricant additives; Sintering additives.The superficial conductive coating processing of metal and non-ferrous metal; Medicine append material; Capacitor materials; Raw material for bulk nanomaterial: Adopt the inert gas to make bulk copper nano composite material with powder metallurgy; Cu Nanoparticles widelly used as Catalysts; Efficacious catalyst: Copper and copper alloy nanometer, feature high efficacy and selectivity, can be used as a catalyst in some reactions, e.g. carbon dioxide compound hydrogen to produce methanol; Cu Nanoparticles used as Conductive coatings; Conductive inks; Conductive slurry: Copper nanopowder can be applied to the productiion of MLCC internal electrodes and other electronic components in electronic slurries for the miniaturization of microelectronic devices; The electronic size with good performance made of copper nanopowder instead of valuable metal particles cuts cost to a large extent; This technology is used to the preference of microelectronic processes; Conductive pastes; Cu Nanoparticles are high thermal conductivity materials; Nanometal Lubricant additives: Adding 0.1~0.6% of copper nanopowder to lubricant oil and lubricant grease. It will form a self-lubricating and self-repairing coating film in the frictioning surface and lower its anti-friction and anti-wear performance; Cu Nanoparticles Lubricant additives; Cu Nanoparticles Sintering additives….

Copper (Cu) Nanoparticles Storage Conditions: Damp reunion will affect its dispersion performance and using effects, therefore, copper nanopowder should be sealed in a vacuum with Argon and stored in a cool and dry room and should not be exposure to air. In addition, Copper (Cu) Nanoparticles should be avoided under stress.

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Ron Calonica

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Nanocopper

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